Laser Materials Processing Division

Facilities (Experimental and characterization)

S. No. Equipment
  1.  
Universal testing machine 150 kN load capacity
  1.  
Universal testing machine 5 kN load capacity
  1.  
X-ray diffraction based residual stress measurement system
  1.  
Micro-hardness tester
  1.  
Metallurgical Microscope
  1.  
Macro-hardness testing machines
  1.  
Portable X-ray Fluorescence Analyser for compositional analysis (Mg - U)
  1.  
In-situ metallography kit
  1.  
Nd:YAG laser (Operating wavelength: 1064, 532 nm, 355 nm and 266 nm, pulse duration : ~8ns)
  1.  
Pulsed laser deposition set-up (Nd:YAG laser)
  1.  
Spectroscopic ellipsometer (Fast mode, wavelength range:250-1700 nm)
  1.  
Spin coating unit (max. speed: 8000 RPM)
  1.  
Dip coating unit (max. retrieval speed: 5 mm/sec )
  1.  
Laboratory oven (max. temperature: 300 °C)
  1.  
Thin film deposition unit (with digital thickness monitor and substrate heating )
  1.  
Fiber spectrometer (wavelength range: 300-1000 nm)
  1.  
UV-VIS-NIR spectrophotometer (wavelength range: 200-2400 nm)
  1.  
Pulsed laser deposition (PLD) facility (KrF excimer laser as source)
  1.  
Atomic layer deposition (ALD) facility
  1.  
Electrical probe station with micro-manipulators and hot chuck
  1.  
Temperature dependent UV-visible photoluminescence spectroscopy
  1.  
DC & Pulsed I-V and C-V characterization setups for transient measurements
  1.  
Temperature dependent Hall and resistivity measurements
  1.  
Clean room for sample processing
  1.  
Piezoelectric characterization facility
  1.  
Miscellaneous facilities for oxide material processing and growth which include bulk ceramic processing, two zone CVD furnace, sputtering, spin coater, vacuum oven, sol-gel processing, controlled ambient processing chamber, plasma surface cleaner etc.
  1.  
RF and DC Sputtering
  1.  
Two zone CVD system for vapour transport growth
  1.  
Impedance spectroscopy and dielectric measurements
  1.  
UV Photo detector characterization facility
  1.  
Wet chemistry lab equipped with fume hood, vacuum oven, hot plate and spin coater, ultrasonic bath cleaner etc. 
  1.  
Integrated glove box system with thermal evaporation system for device fabrication in inert environment
  1.  
Steady state and time resolved photoluminescence measurement (UV-VIS-NIR) system (decay time from ~200 ps to microsecs, RT temp to 10K and emission range 300nm  to 1600nm)
  1.  
Transient and steady state photoconductivity measurement system
  1.  
Polymer poling setup for developing NLO materials
  1.  
Surface profiler for thickness and roughness measurement
  1.  
Wavelength tuneable Nd:YAG based pulsed OPO laser (tuneable range ~ 410-1800nm)
  1.  
Temperature controlled electro-deposition setup
  1.  
Thermal evaporation system
  1.  
Thin film impedance measurement system
  1.  
Optical absorption spectrometer
  1.  
Contact angle measurement system
  1.  
Solar simulator
  1.  
Plasma cleaner system for surface cleaning
  1.  
Stereo zoom microscope for micro devices inspection
  1.  
Source measurement unit for I-V and C-V characterisation of devices
  1.  
Liquid and vacuum phase pulse laser deposition setup with YAG laser as source.